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US Patent Issued to MITSUI CHEMICALS on March 25 for "Method of manufacturing substrate layered body and layered body" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,143, issued on March 25, was assigned to MITSUI CHEMICALS INC. (Tokyo). "Method of manufacturing substrate layered body and layered body" ... Read More


US Patent Issued to WestRock Shared Services on March 25 for "Packaging and blanks therefor" (Georgia Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,192, issued on March 25, was assigned to WestRock Shared Services LLC (Atlanta). "Packaging and blanks therefor" was invented by Kevin M. ... Read More


US Patent Issued to SYMMERA on March 25 for "System and method for pre-shared key (PSK) based content signing for tamper resistance" (California Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,838, issued on March 25, was assigned to SYMMERA INC. (Stamford, Conn.). "System and method for pre-shared key (PSK) based content signing... Read More


US Patent Issued to Xavier University of Louisiana on March 25 for "S6K1 protein kinase inhibitors as cancer therapeutics" (Louisiana Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,315, issued on March 25, was assigned to Xavier University of Louisiana (New Orleans). "S6K1 protein kinase inhibitors as cancer therapeut... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,170, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods... Read More


US Patent Issued to Apple on March 25 for "Latency reduction for beam failure recovery" (Chinese, American Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,399, issued on March 25, was assigned to Apple Inc. (Cupertino, Calif.). "Latency reduction for beam failure recovery" was invented by Yus... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor structure including thermal enhanced bonding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,142, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure including... Read More


US Patent Issued to The Charles Machine Works on March 25 for "Pipeline following sensor arrangement" (Oklahoma Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,094, issued on March 25, was assigned to The Charles Machine Works Inc. (Perry, Okla.). "Pipeline following sensor arrangement" was invent... Read More


US Patent Issued to WUHAN YOUNGSEN BIOTECH on March 25 for "Preparation method for three-layer artificial blood vessel and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,141, issued on March 25, was assigned to WUHAN YOUNGSEN BIOTECH Co. LTD. (Wuhan, China). "Preparation method for three-layer artificial bl... Read More


US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Method and apparatus for supporting edge computing service for roaming UE in wireless communication system" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,447, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method and apparatus for supporting edge c... Read More